Unparalleled Benefits of Mobile Electrostatic Carriers

High Throughput

Room temperature bond/debond in seconds enables rapid throughput for R&D, pilot line or high volume manufacturing

Extraordinary Yield

Near perfect yields due to damage-free, delicate release

Easy & Clean

Easy, user-friendly bonding with no intermediate layers, no adhesives and no extra clean steps

Ultra Low Cost

Single tool and reusable carriers provide lowest total cost of ownership in the industry

Versatile

Handles any shape and 100mm, 150mm, 200mm and 300mm substrates to less than 50 micron wafer thickness

Temporary bonding has emerged as a mission-critical application for production of today's advanced devices in Semiconductor, Automotive, Defense, Quantum Computing, Biomedical and other industries.

Eshylon's new, patented Mobile Electrostatic Carrier (MESC) platform enables leading-edge device fabrication by providing a rigid but mobile platform for handling challenging substrates in an R&D, pilot line or high volume manufacturing environment.

Utilizing electrostatic forces, Eshylon carriers can bond in seconds to a target substrate for processing then release the substrate gently without the need for additional clean steps or adhesives, all on a single tool.

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temporary wafer bonding

Eshylon’s MESCs can bond/debond almost any substrate, including:

  • III-V materials
  • II-VI materials
  • Glass
  • Diamond
  • Sapphire
  • Stainless steel
  • Exotics

"Ultra-thin wafers are the bottleneck for every serious emerging technology of the next five years. And we don't have a way to handle them to achieve the yields we need."

Semiconductor Industry Association

Eshylon technology solves complex handling problems across mission-critical applications

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Facility Bridge (Multiple Size Substrates)

Traditional production tools are configured and optimized for standardized wafers ranging from 100mm to 300mm, and can only process one wafer size without significant costly upgrades. Eshylon MESCs overcome this limitation, enabling dramatic ROI through reuse of 300mm or 200mm tool sets for smaller substrates bonded to Eshylon carriers.

Highlights

Reuse of any pre-existing toolset for small substrate handling

Available in identical form factor of all SEMI-specified silicon wafer sizes

Rapid & versatile conversion of existing capital equipment to new handling requirements

Thin Wafer Handling

With mobile devices forcing miniaturization of packaged ICs, device thickness must be reduced dramatically. Backside thinning of ultra-thin and delicate substrates presents serious wafer handling challenges that Eshylon solves. Good bye breakage, low yields and slow throughput.

Highlights

Fast, high throughput processing with instant, delicate release

Variable bonding voltage to optimize bonding and release of thin or delicate 3/5 materials

High yields and extraordinarily versatile handling applications


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Device Packaging

With 2.5 and 3D packaging applications, device handling challenges have diversified. Eshylon has experience with development of custom packaging-handling applications and form factors, providing application-specific mobile device carriers that can be used in applications such as:

Highlights

Reflow

Plasma and flux cleaning

Loading & unloading into pick-and-place tools

Various other high-temperature cure processes

Our Customers

Eshylon is used by the world's leading companies to solve their complex, leading-edge wafer bonding challenges. We can't name names, but you've heard of all of them, and we'd love to serve you, too.

Contact Us


If you're ready to learn whether the Eshylon platform is right for your needs, we’re ready to help.
here

Eshylon Scientific
1039 Serpentine Lane, Suite F
Pleasanton, CA 94566
(925) 365-1467