Unparalleled Benefits of Mobile Electrostatic Carriers
Room temperature bond/debond in seconds enables rapid throughput for R&D, pilot line or high volume manufacturing
Near perfect yields due to damage-free, delicate release
Easy & Clean
Easy, user-friendly bonding with no intermediate layers, no adhesives and no extra clean steps
Ultra Low Cost
Single tool and reusable carriers provide lowest total cost of ownership in the industry
Handles any shape and 100mm, 150mm, 200mm and 300mm substrates to less than 50 micron wafer thickness
Temporary bonding has emerged as a mission-critical application for production of today's advanced devices in Semiconductor, Automotive, Defense, Quantum Computing, Biomedical and other industries.
Eshylon's new, patented Mobile Electrostatic Carrier (MESC) platform enables leading-edge device fabrication by providing a rigid but mobile platform for handling challenging substrates in an R&D, pilot line or high volume manufacturing environment.
Utilizing electrostatic forces, Eshylon carriers can bond in seconds to a target substrate for processing then release the substrate gently without the need for additional clean steps or adhesives, all on a single tool.
Eshylon’s MESCs can bond/debond almost any substrate, including:
- III-V materials
- II-VI materials
- Stainless steel
"Ultra-thin wafers are the bottleneck for every serious emerging technology of the next five years. And we don't have a way to handle them to achieve the yields we need."
Eshylon technology solves complex handling problems across mission-critical applications
Facility Bridge (Multiple Size Substrates)
Reuse of any pre-existing toolset for small substrate handling
Available in identical form factor of all SEMI-specified silicon wafer sizes
Rapid & versatile conversion of existing capital equipment to new handling requirements
Thin Wafer Handling
Fast, high throughput processing with instant, delicate release
Variable bonding voltage to optimize bonding and release of thin or delicate 3/5 materials
High yields and extraordinarily versatile handling applications
Plasma and flux cleaning
Loading & unloading into pick-and-place tools
Various other high-temperature cure processes
Rapid clean wafer chucks with charged MESCs
Clear alerts without breaking chamber vacuum
Standard wafer form factor MESCs fit all tool configurations
1039 Serpentine Lane, Suite F
Pleasanton, CA 94566